Job ID: JOB_ID_6640
About the Role:
Our client is seeking experienced candidates for a critical PCB Layout Engineer position. This role is essential for developing complex printed circuit board layouts from released schematics, netlists, and detailed engineering requirements. You will be responsible for precise component placement and routing for sophisticated multilayer boards, including designs with high density and controlled impedance requirements. The position involves executing layouts for high-speed digital, power, RF, and mixed-signal applications, ensuring optimal signal integrity, power integrity, EMI mitigation, grounding, and thermal management. A key responsibility includes generating comprehensive fabrication and assembly documentation packages. You will also interface with PCB fabrication and assembly vendors to resolve technical queries and support Design for Manufacturability (DFM) and Design for Testability (DFT) reviews, efficiently incorporating feedback.
Key Responsibilities:
- Develop PCB layouts from released schematics, netlists, and engineering requirements.
- Perform component placement and routing for complex multilayer boards, including high-density and controlled impedance designs.
- Execute high-speed digital, power, RF, and mixed-signal layouts.
- Apply design techniques for signal integrity, power integrity, EMI mitigation, grounding, and thermal management.
- Generate complete fabrication and assembly documentation packages.
- Interface with PCB fabrication and assembly vendors as needed to address technical questions.
- Support DFM/DFT reviews and incorporate feedback efficiently.
MUST HAVES:
- 7+ years of PCB layout experience (senior-level candidates preferred).
- Advanced proficiency in Cadence Allegro PCB Designer/Editor.
- Proven ability to independently complete complex board layouts.
- Strong understanding of IPC standards and PCB fabrication/assembly processes.
- Experience with multilayer stackup, controlled impedance routing, and high-density layouts.
- Demonstrated experience working within structured release and configuration management systems.
Preferred Qualifications:
- IPC CID or CID+ certification.
- Experience with high-speed digital interfaces (DDR, PCIe, SERDES, etc.).
- Experience with RF layout and transmission line design.
- Experience with BGA fan-out and fine-pitch components.
- Experience with power distribution networks and decoupling optimization.
Special Requirements
Regional Candidates only: MD, VA, PA, NJ, DE, NC only. MS Teams Interview Process.
Compensation & Location
Salary: $70,000 – $110,000 per year (Estimated)
Location: Germantown, MD
Recruiter / Company – Contact Information
Email: h.sharma@tekinspirations.com
Recruiter Notice:
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